Yang et al., 2023

technology
science
Author

Yang et al.

Year of Publication

2023

Conference

International Conference on Electronic Materials and Information Engineering

Publisher

Society of Photo-Optical Instrumentation Engineers (SPIE) (Guangzhou, China)

Figure 6. Distribution characteristics of the thermal fatigue life of BGA solder joints Regenerate response1

This paper was flagged by Guillaume Cabanc on PubPeer. One of the authors explained that ChatGPT was used for translation.

References

1Yang G, Cai W, Lin S, Wang T, Fang Z, Wei X. Simulation study on the influence of electronic component heat generation on BGA solder joint thermal fatigue. In: Tan W, Zhang L, eds. International Conference on Electronic Materials and Information Engineering (EMIE 2023). SPIE; :21. doi:10.1117/12.3010708